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HDI PCB, HDI Board, HDI printed circuit board Best Technology 1+N+1 HDI PCB Structure: 1+2+1 HDI PCB. 1+4+1 HDI PCB. 2) HDI PCB (2+N+2 ). Features: Suitable for BGA with smaller ball pitch and higher I/O counts ...
HDI PCB一阶和二阶和三阶如何区分 主题:HDI PCB一阶和二阶和三阶如何区分 ... 第三种是直接从外层打孔至第3层(或N -2层),工艺与前面有很多不同,打孔的难度也更大。 对于三阶的 ...
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HDI-SBU - Technology Capabilities Numer of Layers Max >40 PCB Thickness Max 6,4 mm Inner Layer Thickness Min 25 μm Track Outer Layer 25 μm Inner Layer 25 μm Insulation Outer Layer 25 μm Inner Layer 25 μm Build Up 6+N+6 Max panel size Rigid 640 x 540 mm Solder Gap
PCB Process_Shenzhen Haichuanyingxin Tech CO,.LTD. 2011 Layer Count Up to 48 Layers Minimum Line Width/ Space Inner (2 mil/2 mil) & Outer (3 mil/3 mil) Aspect Ratio 20:1 Board Thickness Tolerance +/- 5% Minimum Core Thickness 2 mil Copper Foil 1/3 oz to 5 oz Maximum Panel size 24" X 32"
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PCB and EDA 筆記~Cadence Allegro: HDI stack-up 分類及比較 2011年10月20日 - HDI stack-up 分類及比較. 此2+N+2製程,laser via1~2、3~4可以疊孔 ...