What is FC LED? - Taiwan Trade FC (Flip-Chip) LED is a new patented technology by mounting the LED diode upside down compare to the present day ...
Assembly Packaging - C4 Flip Chip - High quality Assembly Packaging - C4 Flip Chip manufacturer from Assembly Packaging - COB COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - W
LUXEON FlipChip | Philips Lumileds Lighting Company LUXEON FlipChip High Current Density FlipChip Philips Lumileds LUXEON® FlipChip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die
Pin grid array - Wikipedia, the free encyclopedia A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") a
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Die Attach Adhesive Solutions | AI Technology, Inc. Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape for: Chip Scale Packaging, Stack-Chip Packaging, Through Silicon (STV) Via Filling and Underfill AI Technology, Inc. pioneered the use of flexible die-attach film and paste adhesives for larger chip
Samsung introduces flip-chip mid-and high-power LEDs and COB ... 31 Mar 2014 ... Samsung Electronics has introduced mid- and high-power LEDs built using a flip- chip architecture and is also using the new LEDs in a modular ...
LED Flip Chips & COBs from Applied LED LED Flip Chip and Chip On Board products from Applied LED offer 40% more light output with junction temperatures >23°C less than competitive products.
Confidential- 2013/3/18 - RiteDia 18 Mar 2013 ... DLC LED COB light module. Kevin Kan ... High Brightness & Wide Angle COB SL – series. (Product) ... DLC flip chip light module at 350mA.
COB and Flip-Chip - Surftape.net Tempo Electronics, in conjunction with Bell Labs, the R&D group of Lucent Technologies, have developed and demonstrated a new process for flip-chip ...
