Integrated circuit - Wikipedia, the free encyclopedia An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate ("chip") of semiconductor material, normally silicon. This can be made much smaller than a discre
封裝服務 - Chipbond Website TCP 及COF都是一種IC 封裝技術，是運用軟性基板電路(flexible printed circuit film) 作為封裝晶片的載體，透過熱壓合將晶片上的金凸塊(Gold Bump) 與軟性基板電路 ...
COF (Chip-On-Film) Technology for LCD Driver ICs Using Reel-to ... Abstract. We developed a so-called "reel-to-reel method" COF technology using a long carrier tape for the LCD driver package. This method enables mass ...
南茂科技>> 產品與服務>> 創新技術>> Chip on Film (COF) - ChipMOS As an advanced LCD driver semiconductor packaging technology, COF has many advantages against the conventional tape carrier package (TCP), including ...
Chip on Film (COF) - ChipMOS As an advanced LCD driver semiconductor packaging technology, COF has many advantages against the conventional tape carrier package (TCP), including ...
Chip on Film；COF 薄膜覆晶封裝 - 360° > 技術- DIGITIMES 李洵穎／台北隨著面板廠不斷開出產能，帶動對LCD驅動IC封裝的需求，薄膜覆晶 封裝(COF)為目前TFT LCD內驅動IC的封裝方式之一，在高解析度、高性能、低成本 等 ...
LCD驅動IC封裝型態- 財經百科- 財經知識庫- MoneyDJ理財網 LCD驅動IC之封裝型態可區分為TCP(Tape Carrier Package)、COF(Chip on Film) 及COG(Chip on Glass) 等三類，主流封裝技術原為TCP，因為技術發展不斷高密度 ...
COF Chip-on-film。晶粒軟膜接合。 - 解釋頁 COF是一種將晶粒覆晶接合(Flip Chip Bonding)在軟性電路板(Flexible Printed Circuit board, FPC)基材上的技術。也就是可將驅動IC及其電子零件直接安放於 ...
COF (Chip on Film) | Samsung Semiconductor Global Website Samsung COF (Chip on Film) application areas, features, thermal performance, electrical performance and reliability. Find more package information here.
Acswoa's Home: TCP/COF封裝製程 - yam天空部落 淺談TCP/COF的製程... 隨... ... 術上問題需要克服，目前較少，不過COG是將產品直接銲在LCD面板上，可以節省產品料帶的成本。 TCP的製成和COF是很類似的，但是料帶的設計上則有一些不太一樣，TCP的腳是懸空的，因此在塗膠時，膠體必須依靠治具溫度 ...
